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CuO thin films produced for improving the adhesion between Cu and Al2O3 foils in a direct bonded copper (DBC) process

Castillo, H. A., Restrepo-Parra, E., De La Cruz, W., Bixbi, B., Hernandez, A.
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Abstract

The direct bonded copper (DBC) process was carried out between Cu and Al2O3 foils and CuO thin films were grown on the surface of Cu foils to reduce the defects produced by the DBC on the surface. CuO...

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Taylon & Francis

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Keywords: Adhesion by diffusionCoatingInterfaceSurface caracterizationsSurface treatment

DOI

https://doi.org/10.1080/00218464.2017.1320222

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https://repositorio.cetys.mx/handle/60000/1783

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Atribución-NoComercial-CompartirIgual 2.5 México
Except where otherwised noted, this item's license is described as Atribución-NoComercial-CompartirIgual 2.5 México
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