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dc.contributor.authorHirales-Carbajal, Adán-
dc.date.accessioned2025-08-29T16:58:28Z-
dc.date.available2025-08-29T16:58:28Z-
dc.date.issued2025-08-
dc.identifier.urihttps://repositorio.cetys.mx/handle/60000/1954-
dc.description.abstractThe assembly process in the electronics industry involves integrating various electronic boards and components to ensure proper functionality and communication. During this stage, defects such as missing, floating, and disconnected objects may arise. Failure to detect these can lead to product malfunctions, crashes, or inoperability. This work highlights challenges in a real manufacturing environment, specifically during the validation phase of consumer electronic production. Addressing these issues is crucial and useful, as similar defects can occur in similar consumer electronics manufacturing settings. In this work, we present a solution that integrated a multi-class classifier trained to detect missing and disconnected objects which achieves an average accuracy of 99%.es_ES
dc.description.sponsorshipSPIE DIGITAL LIBRARYes_ES
dc.language.isoen_USes_ES
dc.relation.ispartofseriesConference 13606;13606-42-
dc.rightsAtribución-NoComercial-CompartirIgual 2.5 México*
dc.rights.urihttp://creativecommons.org/licenses/by-nc-sa/2.5/mx/*
dc.subjectvalidaciónes_ES
dc.subjectclasificaciónes_ES
dc.subjectensamblajees_ES
dc.subjectelectrónica de consumoes_ES
dc.titleValidation and classification of assembly defects in consumer electronic motherboardses_ES
dc.title.alternativeSPIEes_ES
dc.typeArticlees_ES
dc.description.urlhttps://spie.org/optics-photonics/presentation/Validation-and-classification-of-assembly-defects-in-consumer-electronic-motherboards/13606-42es_ES
dc.identifier.indexacionSCOPUSes_ES
dc.subject.sedeCampus Tijuanaes_ES
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